Two-component Epoxy Potting Adhesive CT-E3006
Product Features
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Med viscosity & leveling, manual/auto dispenseBalanced flowability with excellent self-leveling joint filling effect
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Room/heat cure, low exotherm, capacitor‑safeSupports dual curing processes. It can complete crosslinking and curing naturally at room temperature, or be heated at medium temperature for accelerated curing, flexibly matching various production cycles.
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High bond strength, multi‑substrate adhesionGeneral adhesion for metals and engineering plastics; delivers strong adhesion to stainless steel, aluminum alloy, PBT and ABS. The bonded joints feature excellent peel resistance, preventing delamination in multi-material assembly encapsulation.
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Waterproof, low attenuation @1k DBL‑85The dense adhesive layer provides long-term water and moisture resistance. It passes the rigorous 1000-hour double 85 aging test, retains high bonding strength in hot and humid environments with slight attenuation of mechanical properties, ensuring durable and stable sealing and adhesion.
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‑40‑105℃ shock‑resistant, 1000h no crack/deformExcellent adaptability to wide temperature range, free from stress damage under thermal cycling. The adhesive layer remains intact without deformation or cracking after 1000-hour temperature shock cycles, ensuring long-term stable sealing of electronic components.
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High dielectric, tracking resistantIt delivers outstanding insulation performance with low electrical conductivity and strong resistance to breakdown under high voltage. No leakage or tracking occurs during long-term service. When used for encapsulating charging guns, aviation plugs and circuit boards, it effectively prevents short circuits for safer operation.
Technical Parameters
| Item | Unit | Standard | ||
|---|---|---|---|---|
|
Before solidification |
Appearance | A Component | / |
Black/bluelyellow viscous liquid |
| B Component | / |
Thansparent liquid |
||
| Viscosiy25℃ | A Component | mPa·s |
12000±2000 |
|
| B Component | mPa·s |
150±50 |
||
| Density | A Component | g/cm3 |
1.50±0.05 |
|
| B Component | g/cm3 |
1.00±0.05 |
||
| Mixing ratio | A:B |
100 :25 |
||
| Mixed viscosity 25°℃ | mPa·s |
2500±500 |
||
|
Operating time 25°C/125g |
min |
>60 |
||
|
Gel tine 25°C/125g |
h |
2 |
||
|
Curing time |
25℃ |
h |
12 |
|
|
80℃ |
h |
1 |
||
|
Before solidification |
Density |
g/cm3 |
1.40±0.05 |
|
|
Hardness |
Shore D |
≥80 |
||
|
Glass transition temperature |
℃ |
≥110 |
||
|
Linearceficient of hermal epansion CTE |
μm/m·℃ |
35 |
||
|
Tensile strength |
MPa |
>30 |
||
|
Elongation at break |
% |
>3 |
||
|
Bending strength |
MPa |
>60 |
||
|
Shear strength A13003/A13003 |
MPa |
≥10 |
||
|
Dielectric strength |
KV/mm |
≥25 |
||
|
Volume resistivity |
Ω·cm |
≥1.0x1015 |
||
|
Dielectric constant |
/ |
3.6 |
||
|
Dielectric loss |
% |
0.8 |
||
|
Thermal conductivity |
W/m · K |
0.45-0.65 |
||
|
Relative leakage index CTI |
V |
600 |
||
Application Areas
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Waterproof Sealing for SupercapacitorsSupercapacitor potting/sealing, moisture barrier, low‑heat cell‑safe cure, high temp & anti‑aging, anti‑leakage -
Waterproof Sealing for Electronic Components Such as CapacitorsCapacitor/electronic sealing, moisture barrier, low‑heat safe cure, high temp & aging resist, anti‑moisture short‑circuit.
Specifications
30 kg per set (Component A: 24 kg per barrel, Component B: 6 kg per barrel)
Storage and Transportation
This product is non-flammable and non-explosive and can be transported as ordinary chemicals. Avoid direct sunlight, extrusion and collision during transportation to prevent leakage.
The shelf life of this product is 6 months.




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