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Products and ServicesAdhesive Product SeriesCT-S3062 Two-Component Silicone Thermal Conductive Potting Compound
CT-S3062 Two-Component Silicone Thermal Conductive Potting Compound

CT-S3062 Two-Component Silicone Thermal Conductive Potting Compound

CT-S3062 is a two-component addition-curing silicone thermal conductive potting compound.Component A of this product is black-gray in color;while Component B is white.Upon thorough mixing,the resultant mixture appears gray.This product features low viscosity and low density, making it particularly suitable for battery potting in new energy vehicles where lightweight requirements are critical.

Core Features

  • Lightweight thermal conduction & heat dissipation
    Lightweight thermal conduction & heat dissipation
    Low-density design efficiently dissipates heat, balancing weight reduction and thermal management.
    Lightweight thermal conduction & heat dissipation
    Lightweight thermal conduction & heat dissipation
  • Flame-retardant & insulating protection
    Flame-retardant & insulating protection
    UL94 V-0 flame retardant and high insulation performance to ensure the safety of high-voltage components
    Flame-retardant & insulating protection
    Flame-retardant & insulating protection
  • Elastic & impact-resistant protection
    Elastic & impact-resistant protection
    Flexible compound absorbs vibration and impact to protect battery cells and circuits.
    Elastic & impact-resistant protection
    Elastic & impact-resistant protection

Features

  • Low-density lightweight design
    Density is approximately 1.35g/cm³, 15%–25% lighter than conventional potting compounds, which effectively reduces the overall weight of equipment and improves cruising range and energy efficiency.
  • Elastic and flexible protection system
    It exhibits medium elasticity after curing (Shore A 40±5), featuring vibration resistance and impact resistance to dynamically protect internal precision components.
  • Excellent process compatibility
    Low viscosity with excellent fluidity; dual curing options at room temperature or under heating for flexible application. Compatible with manual operation and automated production lines for high efficiency.

Technical Parameters

Item Standard

Before solidification

Appearance

A Component

Grey black

B Component

White

Viscosity

A Component

1500~2500MPa ·s

B Component

1500~2500MPa ·s

Density

A Component

1.35±0.05g/cm³

B Component

1.35±0.05g/cm³

A:B Mixing ratio

1:1

Mixed viscosity

1500~2500MPa ·s

Applicable period 100g/25℃

10~60min

Solidification time 25℃

2~3h

Solidification time 80℃

15min

After solidification

Appearance

Grey

Density

1.35±0.05g/cm³

Hardness

40±5 Shore A

Dielectric strength

≥18kV/mm

Dielecriconstant 100MHz

≤3.0

Volume resistiviy

≥1.0×10³Q ·cm

Thermal conductiviy

0.6~0.9W/m ·K

Flame etardant

V-0

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Application Areas

  • New energy vehicles
    New energy vehicles
    Potting for power battery modules / battery packs, on-board chargers and DC-DC converters
  • Lightweight electronics
    Lightweight electronics
    Drones, light energy storage devices, portable high-end electronic equipment
  • Industrial Electronics
    Industrial Electronics
    Thermal dissipation, insulation and protection for sensors, controllers, capacitors and other components

Product Specifications

1.40kg/set  (Component  A:20kg/barrel,Component B:20kg/barrel);
2.Customizable according to customer requirements.

Storage and Transportation

1.Store in a cool,dry,and light-protected place below 25℃,and keep sealed.
2.This product is composed of non-flammable and non-explosive materials and may be transported as general chemicals.During
transportation,precautions should be taken to avoid direct sunlight exposure,compression,and impact to prevent leakage.
3.The shelflife of this product is 6 months.

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