CT-S2151 Silicone Thermal Conductive Adhesive
Product Features
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Short surface drying time,convenient for constructionShort tack-free time enables easy construction operation and effectively improves on-site working efficiency.
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Good thermal conductivity,with a thermal conductivity coefficient of 1.0W/m.K,which is beneficial for the heat dissipation of electronic devices and capacitorsIt features excellent thermal conductivity with a thermal conductivity coefficient up to 1.0 W/m·K. It transfers heat rapidly and effectively reduces temperature rise, making it suitable for heat dissipation applications of electronic components, capacitors and other products.
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Good electrical insulation performanceIt has excellent electrical insulation performance, effectively isolating electric current to prevent electric leakage and short circuits, and ensuring the safe operation of electrical components.
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The cured product has good UV resistance and aging resistanceAfter curing and forming, it resists UV erosion and provides long-term anti-aging performance, resisting yellowing and cracking during long-term outdoor service.
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Excellent resistance to high and low temperature thermal shockIt boasts outstanding resistance to high and low temperature thermal shock. It is unlikely to crack or delaminate under drastic and repeated temperature changes, making it ideal for working conditions with wide temperature fluctuations.
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Good adhesion performance,no detachment after long-term use,no contact gaps,and reduced heat dissipation effectIt features excellent adhesive adhesion, resisting detachment under long-term working conditions. The interface fits tightly without voids, stably maintaining efficient heat dissipation performance.
Technical Parameters
| Item | Unit | Standard | |
|---|---|---|---|
|
Before solidification |
Appearance |
Grey/White |
|
|
Viscosity 25°℃ |
MPa ·s |
Paste |
|
|
Density |
g/cm³ |
2.3~3.0 |
|
|
Surface drying time 25℃ |
min |
5~10 |
|
|
Tensie strength |
MPa |
1.5~2.5 |
|
|
Tensile strength |
% |
≥100 |
|
|
After solidification |
Hardness |
Shore A |
50~80 |
|
Lap shear strength |
MPa |
≥1.5 |
|
|
Dielectric strength |
kV/mm |
≥18 |
|
|
Dielectric constant 50Hz |
|
≤3.0 |
|
|
Volume resistiviy |
Ω ·cm |
≥1.0×10⁵ |
|
|
Thermal conductiviy |
W/m ·K |
≥1.0 |
|
|
Temperature rangefor use |
℃ |
-60~280 |
Application Areas
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Filling and Bonding between CPU and Heat SinkSuitable for gap filling and bonding between CPU chips and heat sinks. It closely bonds the two interfaces, efficiently transfers heat, and provides firm adhesion without detachment. -
Gap Filling and Bonding Between Thyristor Intelligent Control Module and Heat SinkSuitable for gap filling and bonding between thyristor intelligent control modules and heat sinks. It closely adheres to interfaces and delivers both efficient heat conduction and firm bonding performance. -
Gap Filling and Bonding Between High-Power Electrical Modules and Heat SinksIt can fill and bond the gaps between high-power electrical modules and heat sinks, closely fitting contact surfaces to achieve reliable adhesion and efficient heat conduction and dissipation simultaneously.
Specifications
This product is packaged in plastic ubes with a capacity of300ml/tube and 2.6L/tube
Storage and Transportation
1.Store in a cool,dry,and dark place below 25℃,sealed for preservation;
2.This product is a non flammable and non explosive material that can be transported as a general chemical.During transportation,it should be protected from exposure to sunlight,compression,and collision to prevent leakage;
3.The shelf life of this product is 6 months.



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